Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
Industry Directory | Consultant / Service Provider / Manufacturer
Interflux USA, Inc. Mfg. and Distribution of high quality solders, fluxes and solder paste. Specialized in No-Residue soldering.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
New Equipment | Cleaning Equipment
Features: 1. A comprehensive cleaning system: the surface of the product residues of organic matter, inorganic substances for thorough and effective cleaning; 2. Automatic cleaning mode: in a clean room to complete the cleaning, rinsing, drying all
Electronics Forum | Sat Oct 01 11:48:45 EDT 2005 | Hiram
Hello everybody, We are in the process of implementing NC process on the wave solder. We have a Sonotek XL fluxing system. Any ideas out there? Solder used: SN100C Flux options so far: 264-5 flux, 270WR VOC-free 9both from AIM solder) The flux ch
Electronics Forum | Tue Sep 30 20:55:14 EDT 2008 | davef
Residues from different no-clean fluxes produce different levels of variation in RF circuits. Some no-clean fluxes work fine. Following this, a no-clean flux can produce different levels of variation in RF circuits depending on the process setup.
Used SMT Equipment | Soldering - Selective
• Less then 100 hours • Stand-alone Machine • 2 Spray Nozzles/Programable • Dual Solder pots / Dual Heads – Loaded with SAC305 • Heads can run 4 different assembles • Pot level detection / Upgraded self-feeder • Automatic solder refill / Autom
Used SMT Equipment | Pick and Place/Feeders
FUJI SMT machine AIMEX IIIC-Flexible High-Mix Production Freeing up more floor space with its compact design and reduced lengthThis is an all-in-on machine with scalability and the ultimate level of versatility necessary for increasing productivity f
Industry News | 2012-12-14 06:50:53.0
e IPC APEX EXPO® Technical Conference will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.
Industry News | 2022-10-24 08:01:58.0
I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that deliver high reliability. We also stand ready to work with customers in developing improved soldering materials and processes.Our objective is maximizing customer satisfaction by achieving the best possible quality and yield.
Parts & Supplies | Soldering Equipment/Fluxes
we have the following panasonic servo amplifer sell following KXFP6GE1A00 CM402 X-Axis Servo Drive, MR-J2S-40B-EE85 KXFP6GB0A00 CM402 Y-Axis Servo Driver,MR-J2S-100B-EE8 if you are intersting them,pls free contact us
2.jpg)
Parts & Supplies | Assembly Accessories
Right Finger Brush For JT MPS-350 Wave Oven Brushless DC Motor Driver(24 VDC) BLHD30K BRUSH, FEEDER KV7-M8820-20 DC Brushless Motor ES90/ES100 Stainless Steel Brush For JT MPS-350 Finger Left Fing
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
we have many universal gold plus feeders to sell . www.smt-store.com
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon May 10 00:00:00 EDT 2021 - Mon May 10 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Manual Cleaning of Printed Board Assemblies – Step by Step Guide
Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 2nd Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday –Thursday 3:30pm – 1:00am, Friday 2:30pm to 11:00pm Job Description: Performs a variety of dut
Career Center | Montreal, Quebec Canada | Engineering
Schneider Electric #28380 Process Specialist About Schneider Electric As a global specialist in energy management with operations in more than 100 countries, Schneider Electric offers integrated solutions across multiple market segments, inclu
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
Career Center | Poplar Grove, Illinois USA | Management,Production,Quality Control,Technical Support
20+ years in electronic manufacturing, sales support,customer support.
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-lead.php
% to be exact. Solder Paste Dispensing: Leaded vs. Lead Free Solder paste is a mixture of solder spheres and flux formulated for dispensing
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/abstract_form.cfm
): Advanced Packaging Technology Flux/Solder/Adhesive Harsh Environments Inspection (AOI, X-Ray, Other) Lead-Free (Reliability) Manufacturing Excellence Substrates Technical Innovation Subject Focus
